Wire bonder

• Model ( HB-100 ) and company (TPT), Location (Device Room 5)

 Superuser (Xingjuan Song), contacts (15527359929/wechat ID: juan921217826)

• Brief description: 

   The TPT HB-100 is a wire bonder used for creating electrical interconnections in semiconductor devices and microelectronics. Its primary principle is wedge-wedge bonding, where ultrasonic energy and force are applied to a fine wire (typically aluminum or gold), forming a strong, reliable weld between a chip's contact pad and a package lead. It is ideal for prototyping, research, and small-scale production.

• Specifications:  

    - Supports wedge, ball, and ribbon bonding with a single, easily modified bond head.

    - Dual-camera system with auto-focus and 150x magnification for live monitoring.

    - Features motorized X/Y/Z/Theta axes with ≤0.1µm resolution on X/Y.

    - Delivers 0-5W of power at a 62 kHz frequency with a bond force up to 200 cN

    - Software-controlled heating up to 200°C with high precision (±1°C).

    - Operated via a 21" touchscreen and joystick on a Windows platform

    - Uses 17-75µm gold (Au) and aluminum (Al) wires.